The resist film is developed in the left bath of this wet bench. After development, the resist remaining on
the wafer has the same pattern as the shadow "mask" that exposed it.
The developer is then rinsed away in the center bath of this bench.
Finally, after etching (in the wet bench to the right of this one), the photoresist pattern is then removed
("stripped") from the chip using the solvent in the right bath of this bench.
