We Can Figure This Out.org
Virtual Lab: Minilab ? Lithography
University of Virginia
             
 
© 2003-Present, John C. Bean
 
The photoresist is spun onto the wafer at 3000 RPM for 30 sec. The material datasheets provided by the manufacturer say that this should give a film thickness around 2 microns. The wafer is now ready for a pre-bake.
 
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